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SETSCI - Volume 1 (2017) ISMSIT2017 - International Symposium on Multidisciplinary Studies and Innovative Technologies, Tokat, Turkey, Dec 02, 2017 |
 | New Trends in Thermal Interface Materials for High-Power LED Packaging Systems |
 | Suna Avcıoğlu1*, Sinem Çevik2 | 1Ondokuz Mayıs University, Samsun, Turkey 2Ondokuz Mayıs University, Samsun, Turkey
| * Corresponding author: sunaavcioglu@gmail.com | Published Date: 2017-12-08 | Page (s): 188-191 | 713 7 |
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