Journals Books 2687-5527 doi.org/10.36287/setsci
Latest Issue Archive Future Issues About Us
Conference Proceedings

SETSCI - Volume 1 (2017)
ISMSIT2017 - International Symposium on Multidisciplinary Studies and Innovative Technologies, Tokat, Turkey, Dec 02, 2017

New Trends in Thermal Interface Materials for High-Power LED Packaging Systems
Suna Avcıoğlu1*, Sinem Çevik2
1Ondokuz Mayıs University, Samsun, Turkey
2Ondokuz Mayıs University, Samsun, Turkey
* Corresponding author: sunaavcioglu@gmail.com
Published Date: 2017-12-08   |   Page (s): 188-191   |    592     6
ABSTRACT For a successful thermal performance, the right choice and design of the thermal management materials used in LED die-moulding, cooler and soldered parts is a critical engineering problem. Because they are affected by heat emitted from the pn junction in the LED array and have a great effect on the removal of this heat. Junction temperature is affected by many factors. These are the cooling system, ambient and thermal interface material. Nowadays, low cost and highly successful thermal management solutions are urgently needed. Many solutions have been proposed to provide this kind of heat management. In this study, new approaches to improve the thermal performance of high-power LED packaging systems were investigated and reviewed. Commercial and conventional thermal interface materials were compared with ceramic materials according to their
suitability, production conditions, and thermal properties.  
KEYWORDS LED, Thermal interface material, Nitride ceramics, Heat Sink
REFERENCES [1] URL1:https://www.edn.com/electronics-blogs/ledinsights/4422914/Cooling-high-power-LEDs--The-four-myths-aboutactive-vs--passive-methods Son erişim tarihi:18.05.2017

[2] URL 2: ”1000W LED Food Light: Profecional Design” https://www.apollolumens.com/product/1000w-led-flood-light/ Son erişim tarihi:18.05.2017

[3] OSRM, “Thermal Management of Light Sources Based on SMD LEDs” Application note, (2013)

[4] URL 3:https://www.led-professional.com/resources-1/articles/thermaltransient-testing-of-leds-for-more-reliable-ssl-products-by-mentorgraphics

[5] Leong, C.K., Aoyagi, Y., Chung,D.D.L.: Carbon black pastes as coating for improvement thermal gap-filling material. Carbon. 44, 435–440 (2006)

[6] Anithambigai, P., Dinash, K., Mutharasu, D., Shanmugan, S., Lim, C.K.: Thermal analysis of power LED employing dual interface method and water flow as a cooling system. Thermochim. Acta 523, 237–244 (2011)

[7] Gwinn, J.P., Webb, R.L.: Performance and testing of thermal interface materials. Microelectr. J. 34, 215–222 (2003)

[8] Jagannadham, K., Sharma, A.K., Wei, Q., Kalyanraman, R., Narayan, J.: structural characteristics of AlN films deposited by pulsed laser deposition and reactive magnetron sputtering: a comparative study. J. Vac. Sci. Technol. 16, 2804–2815 (1998)

[9] Park,M.H.,Kim,S.H.: Thermal conductivity of AlN thin films deposited by RF magnetrons puttering. Mater. Sci. Semicond. Process. 15, 6–10 (2012)

[10] Okamoto, M., Yap, Y. K., Yoshimura, M., Mori, Y., Sasaki, T.: Fabrication of conductive AlN films by pulsed laser deposition. In: Proceedings of the International Workshopon Nitride Semiconductors, pp. 198–201 (2000)

[11] Pantha,B.N.,Sedhain,A.,Li,J.,Lin,J.Y.,Jiang,H.X.: Probing the relationship between structural and optical properties Si-doped AlN. Appl. Phy. Lett, 96, (2010).

[12] Shanmugan, S., Mutharasu, D., Kamarulazizi, I.: BN thin film as thermal interface mateiral for high power LED: thermal resistance and optical analysis. Opt. Quantum Electron. 46, 337–344 (2014)

[13] X. Luo, W. Xiong, T. Cheng, S. Liu, Design and optimization of horizontally-located plate fin heat sink for high power LED street lamps, 2009 IEEE Electronic Components and Technology Conference (2009) 854-859, San Diego, California, (2009)

[14] M. Arika, C. Beckerb, S. Weaverb, J. Petroskic, Thermal management of LEDs: package to system, Third International Conference on Solid State Lighting SPIE, Bellingham, WA, (2004).

[15] G. Scheepers, J. A. Visser, Detailed thermal modeling of high powered LEDs, 25th IEEE SEMITHERM Symposium 2009, San José, California, (2009).

[16] Y. G.-Ying, Z. X. Ping, H. S.-Hong, H. W-Wen, G. T.-Tai, Thermal simulation and optimization design on a high power LED spot lamp, Optoelectronics Letters 7 (2) (2011).

[17] A. Christensen, S. Graham, Thermal effects in packaging high power light emitting diode arrays, Applied Thermal Engineering 29 364–371 (2009).

[18] W.-H. Chi, T.-L. Chou, C.-N. Han, K.-N. Chiang, Analysis of thermal performance of high power light emitting diodes package, IEEE 2008 10th Electronics Packaging Technology Conference, Singapore, (2008)

[19] C.-J. Weng, Advanced thermal enhancement and management of LED packages, International Communications in Heat and Mass Transfer 36 245–248 (2009)

[20] S.-H. Yu, K.-S. Lee, S.-J. Yook, Optimum design of a radial heat sink under natural convection, International Journal of Heat and Mass Transfer 54 2499–2505 (2011)

[21] S.-H. Yu, K.-S. Lee, S.-J. Yook, Natural convection around a radial heat sink, International Journal of Heat and Mass Transfer 53 2935– 2938 (2010)

[22] B.-J. Huang, C.-W. Tang, M.-S. Wu, System dynamics model of highpower LED luminaire, Applied Thermal Engineering 29 609–616 (2009)

[23] F. Houl, D. Yangl, G. Q. Zhangl, Y. Hail, D. Liul, L. Liul, Thermal transient analysis of LED array system with in-line pin fin heat sink, 12th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems, IEEE EuroSimE 2011, Linz, Austria, (2011).

[24] M. S. Ha, Thermal Analysis of High Power LED Arrays, MSc. Thesis, School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, (2009).

[25] S.-H. Yu, D. Jang, K.-S. Lee, Effect of radiation in a radial heat sink under natural convection, International Journal of Heat and Mass Transfer 55 505–509
2012).


SET Technology - Turkey
eISSN  : 2687-5527    
DOI : doi.org/10.36287/setsci

E-mail : info@set-science.com
+90 533 2245325

Tokat Technology Development Zone Gaziosmanpaşa University Taşlıçiftlik Campus, 60240 TOKAT-TURKEY
©2018 SET Technology