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SETSCI - Volume 1 (2017)
ISMSIT2017 - International Symposium on Multidisciplinary Studies and Innovative Technologies, Tokat, Turkey, Dec 02, 2017

New Trends in Thermal Interface Materials for High-Power LED Packaging Systems
Suna Avcıoğlu1*, Sinem Çevik2
1Ondokuz Mayıs University, Samsun, Turkey
2Ondokuz Mayıs University, Samsun, Turkey
* Corresponding author:
Published Date: 2017-12-08   |   Page (s): 188-191   |    713     7

ABSTRACT For a successful thermal performance, the right choice and design of the thermal management materials used in LED die-moulding, cooler and soldered parts is a critical engineering problem. Because they are affected by heat emitted from the pn junction in the LED array and have a great effect on the removal of this heat. Junction temperature is affected by many factors. These are the cooling system, ambient and thermal interface material. Nowadays, low cost and highly successful thermal management solutions are urgently needed. Many solutions have been proposed to provide this kind of heat management. In this study, new approaches to improve the thermal performance of high-power LED packaging systems were investigated and reviewed. Commercial and conventional thermal interface materials were compared with ceramic materials according to their
suitability, production conditions, and thermal properties.  
KEYWORDS LED, Thermal interface material, Nitride ceramics, Heat Sink
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