{ "article_id": 1124, "public_id": "f9225cdd-ce7c-4aeb-b16f-72adbe30cd68", "internal_identifier": null, "source_identifier": "42:129", "status": "published", "type": "research_article", "title": "Örnek Bir Elektronik Baskı Devresinde Soğutma Performansını Arttırmak için Kullanılan Via Uygulamasının Jonksiyon Sıcaklığına Etkilerinin Araştırılması", "title_secondary": null, "abstract": "Çalışmamızda Samsung PLCC4 LED ve elektronik bileşenlerinin jonksiyon sıcaklığı üzerinde via etkisi hesaplamalı akışkanlar mekaniği analizleri ile araştırılmıştır. Analizlerde FloEFD 17.4 hesaplamalı akışkanlar dinamiği ticari programı kullanılmıştır. Elektronik komponentlerin ve diğer parçaların termal açıdan dayanımını kontrol etmek için analiz sınır şartlarının belirlenmesinde VW Şartnamesi (LAH.000.945) dikkate alınmıştır. Elektronik bileşenler silikon olarak, soğutucu kanatçıklar alüminyum ve LED yazılım içinde çip olarak tanımlanmıştır. Bu malzemelerin ısıl iletkenlik katsayıları, yoğunlukları, ısı sığaları programa girilmiştir. Via elektronik kartlar üzerinde ısı transferini hızlandıran baskı devresinin üzerine açılmış bakırla kaplanmış ufak deliklerdir. Çalışmada yapılan analizlerde ortam sıcaklığı 23°C olarak alınmıştır. Yerçekimi etkileri dikkate alınmıştır. Solar radyasyon uygulanmamıştır. İlgili elektronik bileşenlerin üzerinden geçen akım değeri 0.18A, LED sürüm gerilim değeri maksimum 2.5 V olarak alınmıştır. İlk analizde via sayısı 101 adet iken ikinci analizde via sayısı 2 katına çıkarılarak 202 adet\r\nolarak alınmıştır. Via sayısı 101 adet olan elektronik devre analiz sonucunda elde edilen LED üzerindeki maksimum sıcaklık değeri 70,01 °C dir. LED jonksiyon sıcaklığı 102,86° C olarak hesaplanmıştır. Via sayısı 202 olan devre analiz sonucunda Led üzerindeki maksimum sıcaklık değeri 69,79 °C ve Led jonksiyon sıcaklığı 102,64° C olarak hesaplanmıştır. Sonuç olarak via sayısının elektronik bileşenler üzerinde sıcaklık bakımından çok yüksek bir etkisinin olmadığı tespit edilmiştir. Bu sonucun baskı\r\ndevresinin boyutlarının küçük olmasından kaynaklı olabileceği düşünülmektedir. Farklı boyutlularda baskı devrelerinde inceleme yapılmaya devam edilmektedir.  ", "language": "tr", "english_title": "Investigation of the Effects of Via Application Used to Improve Cooling Performance on Junction Temperature in a Sample Electronic Printed Circuit Board", "english_abstract": "In our study, the effect of via on the junction temperature of Samsung PLCC4 LED and electronic components was investigated using computational fluid mechanics analyses. The FloEFD 17.4 computational fluid dynamics commercial program was used in the analyses. To control the thermal resistance of electronic components and other parts, the VW Specification (LAH.000.945) was considered in determining the analysis boundary conditions. Electronic components were defined as silicon, cooling fins as aluminum, and the LED as a chip within the software. The thermal conductivity coefficients, densities, and heat capacities of these materials were entered into the program. Via are small copper-plated holes opened on the printed circuit board that accelerate heat transfer on electronic boards. In the analyses performed in this study, the ambient temperature was taken as 23°C. Gravity effects were considered. Solar radiation was not applied. The current passing through the relevant electronic components was taken as 0.18A, and the LED transmission voltage value was taken as a maximum of 2.5 V. In the first analysis, the number of vias was 101, while in the second analysis, the number of vias was doubled to 202. The maximum temperature on the LED obtained as a result of the analysis of the electronic circuit with 101 vias is 70.01 °C. The LED junction temperature was calculated as 102.86 °C. As a result of the analysis of the circuit with 202 vias, the maximum temperature on the LED is 69.79 °C and the LED junction temperature is 102.64 °C. In conclusion, it was determined that the number of vias does not have a very high effect on the temperature of the electronic components. It is thought that this result may be due to the small dimensions of the printed circuit board. Studies are continuing on printed circuit boards of different sizes.", "doi": null, "doi_url": null, "resource_url": "https://www.set-science.com/a/f9225cdd-ce7c-4aeb-b16f-72adbe30cd68", "pdf_url": "https://www.set-science.com/a/f9225cdd-ce7c-4aeb-b16f-72adbe30cd68/pdf", "og_image": "https://www.set-science.com/assets/img/og-card-v2.png", "authors": [ { "public_id": "a7d50d0f-f71a-496d-8b95-de61953babc8", "given": "K.Furkan   ", "family": "Sökmen", "full": "K.Furkan    Sökmen", "literal": null, "orcid": null, "orcid_url": null, "email": "furkan.sokmen@btu.edu.tr", "corresponding": true, "sequence": "first", "affiliations": [ { "name": "Bursa Technical University", "department": null, "country": null, "country_code": null, "ror": null, "ror_url": null } ] }, { "public_id": "86f605a4-1fe7-482f-b6a6-074517e19790", "given": "Osman Bedrettin   ", "family": "Karataş", "full": "Osman Bedrettin    Karataş", "literal": null, "orcid": null, "orcid_url": null, "email": "furkan.sokmen@btu.edu.tr", "corresponding": false, "sequence": "additional", "affiliations": [ { "name": "Bursa Technical University", "department": null, "country": null, "country_code": null, "ror": null, "ror_url": null } ] } ], "keywords": [ "Hesaplamalı Akışkanlar Mekaniği", "elektronik soğutma", "ısı transferi", "LED", "via" ], "translations": [ { "language": "en", "title": "Investigation of the Effects of Via Application Used to Improve Cooling Performance on Junction Temperature in a Sample Electronic Printed Circuit Board", "abstract": "In our study, the effect of via on the junction temperature of Samsung PLCC4 LED and electronic components was investigated using computational fluid mechanics analyses. The FloEFD 17.4 computational fluid dynamics commercial program was used in the analyses. To control the thermal resistance of electronic components and other parts, the VW Specification (LAH.000.945) was considered in determining the analysis boundary conditions. Electronic components were defined as silicon, cooling fins as aluminum, and the LED as a chip within the software. The thermal conductivity coefficients, densities, and heat capacities of these materials were entered into the program. Via are small copper-plated holes opened on the printed circuit board that accelerate heat transfer on electronic boards. In the analyses performed in this study, the ambient temperature was taken as 23°C. Gravity effects were considered. Solar radiation was not applied. The current passing through the relevant electronic components was taken as 0.18A, and the LED transmission voltage value was taken as a maximum of 2.5 V. In the first analysis, the number of vias was 101, while in the second analysis, the number of vias was doubled to 202. The maximum temperature on the LED obtained as a result of the analysis of the electronic circuit with 101 vias is 70.01 °C. The LED junction temperature was calculated as 102.86 °C. As a result of the analysis of the circuit with 202 vias, the maximum temperature on the LED is 69.79 °C and the LED junction temperature is 102.64 °C. In conclusion, it was determined that the number of vias does not have a very high effect on the temperature of the electronic components. It is thought that this result may be due to the small dimensions of the printed circuit board. Studies are continuing on printed circuit boards of different sizes.", "keywords": [ "Computational Fluid Mechanics", "electronic cooling", "heat transfer", "LED", "via" ] } ], "subjects": [], "subject_names": [], "published_date": "2019-06-01", "published_year": "2019", "received_date": null, "accepted_date": null, "volume": "4", "issue": null, "page_first": "656", "page_last": "659", "article_number": null, "conference": { "short_name": "ISAS2019-ENS", "full_title": "3rd International Symposium on Innovative Approaches in Scientific Studies (Engineering and Natural Sciences)", "name": "3rd International Symposium on Innovative Approaches in Scientific Studies (Engineering and Natural Sciences)", "acronym": "ISAS2019-ENS", "location": "Ankara, Türkiye", "start_date": "2019-04-19", "end_date": null, "public_id": "ed3b36e9-38cf-4aeb-a135-833c969cc89f" }, "proceedings": { "title": "3rd International Symposium on Innovative Approaches in Scientific Studies (Engineering and Natural Sciences)", "series_title": "Setsci conference indexing system", "publisher": "SET Technology", "isbn": null, "eisbn": null, "issn": "2618-6446", "eissn": null, "doi": null, "doi_prefix": null, "slug": "setsci-volume-4-2019-legacy-42", "public_id": "24d215ef-a545-4351-9725-6e9bdb167b3c", "url": "https://www.set-science.com/p/setsci-volume-4-2019-legacy-42" }, "license": { "name": "CC BY 4.0", "url": "https://creativecommons.org/licenses/by/4.0/", "code": "CC-BY-4.0", "open_access": true }, "copyright": { "holder": "SET Technology", "year": "2019" }, "funding_statement": null, "funders": [], "references": [ { "order": 1, "raw": "M., Alan, Solid state lighting- a world of expanding opportunities at LED 2002, III-Vs Review v16 (1) : 30-33, 2003", "doi": null, "title": null, "authors": null, "source": null, "year": null, "volume": null, "pages": null }, { "order": 2, "raw": "Liu, S., Lin,T., Luo X., Chen M., Jiang X, A Microjet Array Cooling System For Thermal Management of Active Radars and HighBrightness LEDs, Electronic Comznts and Technology Conference, 2006", "doi": null, "title": null, "authors": null, "source": null, "year": null, "volume": null, "pages": null }, { "order": 3, "raw": "Mehmet A,, S Weaver,., Chip scale thermal management of high brightness LED packages, Fourth International Conference on Solid State Lighting: 214-223, 2004", "doi": null, "title": null, "authors": null, "source": null, "year": null, "volume": null, "pages": null }, { "order": 4, "raw": "Mehmet A,., C Becker., S Weaver., J., Petroski.,, Thermal Management of LEDs: Package to System , Proc. of SPIE Vol. 5187, 2004", "doi": null, "title": null, "authors": null, "source": null, "year": null, "volume": null, "pages": null }, { "order": 5, "raw": "J Petroski., Understanding longitudinal fin heat sink orientation sensitivity for Light Emitting Diode (LED) lighting applications, International Electronic Packaging Technical Conference and Exhibition: 111-117, 2003", "doi": null, "title": null, "authors": null, "source": null, "year": null, "volume": null, "pages": null }, { "order": 6, "raw": "K.C. 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