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Research Article Open Access New Trends in Thermal Interface Materials for High-Power LED Packaging Systems

Suna Avcıoğlu, Avcıoğlu S, Sinem Çevik, Çevik S

International Symposium on Multidisciplinary Studies and Innovative Technologies 2017

For a successful thermal performance, the right choice and design of the thermal management materials used in LED die-moulding, cooler and soldered parts is a critical engineering problem. Because they are affected by heat emitted from the …

Research Contributions (2019+)Peer reviewed by at least two reviewers

Open AccessCC BY 4.0

Open Discovery Metadata · DOI · OAI-PMH

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